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    Position:Home > Products > Diamond wire saw > Micrometer wire of diamond 310-350 (silicon wafer cutting and root)
    • +86-371-63379559
    • info@sinocrystal.com.cn
    • Building 30#, No. 20 Bitao Road, High and New Technology Development Zone, Zhengzhou
     

    Micrometer wire of diamond 310-350 (silicon wafer cutting and root)

    date:2015-06-23 13:25  hits:  size【big | normal | small

    1. Diamond is well- packaged; sharpness is good.
    2. Cutting speed is fast, capacity is high with low cost.
    3. Advanced and stable technique with high precision of cutting.
    4. Low cost of operation.
    1495澳门新葡亰下载