1495澳门新葡亰下载-客户端下载

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    Position:Home > Products > Diamond wire saw > Micrometer wire of diamond 150 (silicon wafer slicing)
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    • info@sinocrystal.com.cn
    • Building 30#, No. 20 Bitao Road, High and New Technology Development Zone, Zhengzhou
     

    Micrometer wire of diamond 150 (silicon wafer slicing)

    date:2015-06-23 13:25  hits:  size【big | normal | small

    1. Diamond is well-distributed and packaged; sharpness is good and efficiency is high.
    2. Lost of kerf is low with high capacity.
    3. Cutting technique is stable and wafer is even.
    4. Reject of cut silicon is recyclable and cost is low.
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